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10 个月前
BRIEF-Radient Tech completes final tranche of private placement
2016年10月14日 / 晚上11点47分 / 10 个月前

BRIEF-Radient Tech completes final tranche of private placement

Oct 14 (Reuters) - Radient Technologies Inc

* Radient Technologies Inc. Announces completion of third and final tranche of private placement and partial closing of shares for debt transaction Source text for Eikon: Further company coverage:

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