Reuters logo
BRIEF-Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution
2017年8月30日 / 上午10点07分 / 3 个月前

BRIEF-Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

Aug 30 (Reuters) - Himax Technologies Inc

* Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

* Qualcomm Inc - ‍co and Himax will commercialize SLiM 3D camera as a total camera system solution with mass production targeting in Q1/2018​ Source text for Eikon: Further company coverage:

我们的标准:汤森路透“信任原则”
0 : 0
  • narrow-browser-and-phone
  • medium-browser-and-portrait-tablet
  • landscape-tablet
  • medium-wide-browser
  • wide-browser-and-larger
  • medium-browser-and-landscape-tablet
  • medium-wide-browser-and-larger
  • above-phone
  • portrait-tablet-and-above
  • above-portrait-tablet
  • landscape-tablet-and-above
  • landscape-tablet-and-medium-wide-browser
  • portrait-tablet-and-below
  • landscape-tablet-and-below