June 21, 2010 / 8:13 AM / 8 years ago

Elpida and 2 Taiwan firms tie up in chip packaging

TOKYO, June 21 (Reuters) - Japan's Elpida Memory Inc 6665.T said on Monday that it would tie up with Taiwan's United Microelectronics Corp (2303.TW) and Powertech Technology Inc (6239.TW) to develop advanced semiconductor packaging technology.

The companies said in a statement the alliance would leverage the strengths in Elpida's DRAM, PTI's assembly and UMC's foundry logic technologies to develop a "one-chip solution".

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